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Printing machine×谷電機工業 - List of Manufacturers, Suppliers, Companies and Products

Printing machine Product List

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Guden Electric Machinery Co., Ltd. Business Introduction

Guden Electric Machinery Co., Ltd. Business Introduction

We provide solutions from the "manufacturing site" in Fukushima!

The business of Guden Machinery Co., Ltd. consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. We possess different businesses in printed circuit board assembly, assembly of LCD products, repair services, and the manufacturing and sales of our own developed equipment, allowing us to meet our customers' needs 100%. Our business model involves the product development business supporting the core SMT related business and semiconductor related business from both software and hardware perspectives. 【Business Overview】 ■ SMT related business ■ Semiconductor related business ■ Product development business *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Contract manufacturing

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Solder paste printer "TD-4420" & bumping service

Solder paste printer "TD-4420" & bumping service

Sales of solder paste printers compatible with narrow and narrow-pitch applications with a printing accuracy of ±10μm, as well as contract services such as bumping!

The "Solder Paste Printer TD-4420" is a paste press-in type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer "TD-4420" - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measurement Device - X-ray Observation Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in a Class 10,000 clean room are also available. Please feel free to contact us.

  • Soldering Equipment
  • Solder
  • Processing Contract

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Past development cases

Past development cases

Introducing development examples such as "cream solder printing devices" and "low-temperature saunas"!

We would like to introduce the "past development cases" of Guden Machinery Co., Ltd. Various products have been developed, such as the "Aqua Fryer," inspired by the process of frying tempura, and the "Color Image Encryption Software," which uses color image data as an encryption key. All of these are products for which patents have been obtained in the past. 【Examples】 ■ Cream solder printing device ■ Aqua Fryer ■ Color image encryption software (FCN) ■ Low-temperature sauna *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Contract manufacturing

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Solder paste printer "TD-4420" & bumping service

Solder paste printer "TD-4420" & bumping service

A must-see for electronic device manufacturers! Sales of solder paste printers compatible with narrow and fine pitch, with a printing accuracy of ±10μm, and contract services such as bumping!

The "Solder Paste Printer TD-4420" is a paste insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main equipment) - Solder paste printer "TD-4420" - N2 reflow oven - Flux cleaning machine - Flattening device - Bump height measurement device - X-ray observation device (Main solder bumping achievements) - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also possible. Please feel free to contact us.

  • Soldering Equipment
  • Solder
  • Processing Contract

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[Case Study] Communication Device Manufacturer Company A

[Case Study] Communication Device Manufacturer Company A

Successfully achieved wafer bumping with a 180μm pitch! Established a mass production line using screen printing.

The development team at Company A was conducting evaluation experiments with several printing machine manufacturers in anticipation of mass production of a new communication device for mobile terminals, focusing on solder bumping through screen printing. However, they were not achieving satisfactory results. In response, we proposed utilizing the filling pressure control feature of the press-fit squeegee unit equipped in our printing machine "TD-4420 series" with the following suggestions: - "Proposing pressurization conditions that allow 100% solder paste filling within the mask opening." - "Recommending the use of high-viscosity solder paste of approximately 280 Pa·s, which cannot be handled by conventional printing machines, as a countermeasure against solder bridging." The issues that had been troublesome during evaluation experiments with other manufacturers' printing machines were resolved quite easily, allowing them to start mass production as planned without significantly revising the new product's production process. [Proposed Product] - Solder paste printing machine "TD-4420" - Squeegee unit - Wet cleaner *For more details, please refer to the PDF document or feel free to contact us.*

  • Printing Machinery
  • Other mounting machines
  • Other semiconductor manufacturing equipment

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Solder Paste Printer [Achieving Various Printing Forms!]

Solder Paste Printer [Achieving Various Printing Forms!]

A solder paste printer that realizes a variety of printing forms made possible by the press-in method!

This is a printing machine that solely pursues stable high-quality printing. It is equipped with a uniquely developed press-in squeegee unit, capable of meeting various printing needs from high-density patterns to large-diameter thick film printing. (Main Features) ● The cartridge, which is shielded from outside air, stores solder paste, preventing deterioration such as oxidation. ● The rotation pressure of the roller shaft inside the cartridge reliably fills the solder paste into the mask opening. ● The automatic solder paste replenishment function maintains a constant amount of solder paste within the cartridge. ● The automatic stirring mechanism keeps the viscosity of the solder paste inside the cartridge consistent. ● After squeegeeing, the machine automatically recovers the solder paste each time, leaving no solder paste on the mask. ● By combining contact printing and off-contact printing, the "hybrid squeegeeing" accommodates a variety of printing forms. *For more details, please request materials or view the PDF data available for download.

  • Other mounting machines
  • Other semiconductor manufacturing equipment
  • Printing Machinery

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Until the via filling of conductive paste! Solder paste printer TD-4420

Until the via filling of conductive paste! Solder paste printer TD-4420

High precision design with a printing accuracy of ±10μm supports narrow and narrow-pitch printing! By realizing 'hybrid squeegeeing,' we challenge the limits of screen printing.

The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste injection method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8 inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4 inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from outside air, which helps prevent deterioration such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a constant amount and viscosity of the paste within the cartridge. - The printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demonstrations in a clean room (Class 10,000) are also possible. Please feel free to contact us.

  • Soldering Equipment

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Technical Data: Solder Paste Printer

Technical Data: Solder Paste Printer

Publishing the printing results of bump printing and thick film printing! Clearly explained with illustrations.

This document introduces the "solder paste printing machine" handled by Tani Electric Industry. It includes features, as well as printing results for fine printing, bump printing, and thick film printing. The information is presented clearly along with illustrations, so please take a moment to read it. 【Contents (excerpt)】 ■Feature 1: Press-fit cassette squeegee ■Feature 2: Dry cleaner ■Feature 3: Backup plate separation ■Further fine printing: Squeegee ■Further fine printing: Others *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Solder
  • Processing Contract

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